Application: The machine is mainly used for pasting up silicon wafers or germanium wafers on wafer-pasting plate before single-sided polishing or thinning or lapping. Main features: 1. Key components are from world famous manufacturers. 2. Wafers’ heating and cooling are controlled with micro-computer, PLC 3. The machine automatically control wafers’ moving, pressuring and cooling. It runs smoothly. 4. The up-and-down movement and side to side movement of wafers can be either manually or automatically controlled. It is easy to operate and maintain the machine. 5. Equipped with programmable controller, digital temperature controller and buzzer from OMRON 6. Beautiful appearance. Main Specifications: 1. Diameter of wafer-pasting plate: Φ305mm 2. Quantity of pasted wafers: 40 pieces for work-pieces with diameter ofΦ35mm 5 pieces for work-pieces with diameter ofΦ100mm 3. Heating up temperature: 0-200℃ (adjustable) 4. Pressure: 0～0.15Mpa (adjustable) 5. Cooling time: 0～20min. (adjustable) 6. Total power: 1.5kW (three heating pipes) 7. Power supply: 380V 50Hz 8. Compressed air: 0.4Mpa 9. Machine dimensions (L×W×H): 1595mm×600mm×1200mm 10. Machine weight: about 250kg
