C61 485-1 Automatic Die Bonding Machine
Application：
This machine is mainly used for bonding silicon wafer, germanium wafer and other electrical materials before polishing. It also used for bonding electrical materials while single-sided thinning or single-sided lapping.
Features:
 PLC control makes sure the machine’s reliability and security.
 Equipped with heating system and cooling system makes the machine efficient.
 Equipped with urgent stop button.
 Easy operation and simply maintenance.
Main Specifications:
 Dimensions of bonding plate: φ485mm
 Processing quantity: 75 pieces for Φ35mm or 17 pieces forφ75mm
or 10 pieces for φ100mm
 Heating temperature: 0~200℃
 Max pressure: 0~0.15Mpa
 Cooling time: 0~20min
 Main power: 1.2Kw (6 heating pipes)
 Machine dimensions (L×W×H): 2055mm×825mm×1300mm
 Machine weight: about 1000KG