C66 100-2/YJ Silicon Wafer Chamfering Machine
Application:
This equipment can be used for chamfering/beveling silicon wafers or other hard, fragile flat materials after cutting or grinding.
Main technical parameters:
1. Dimensions of grinding wheel (outer dia.×inner dia.×thickness): ф50mm☓ф9mm☓6mm
2. Rotation speed of the main shaft:
(1). Rotation speed while chamfering/beveling: 3 ~ 5rpm
(2). Rotation speed while drying: 0 ~ 7000rpm
(3). Rotation speed while watering: 0 ~ 4500rpm
3. Diameter of silicon wafers: ф35mm ~ф100mm
4. Thickness of silicon wafers: 0.3 ~ 1.5mm
5. Dimensions of carriers: 30mm or 40mm or 66mm or 86mm
6. Power: 220V 0.3kW
7. Machine dimensions(L☓W☓H): 700mm☓500mm☓380mm
8. Machine weight: about 60kg