Ⅰ. Предназначение продукции
Данное оборудование в основном предназначено для односторонней полировки и обработки с высокой точностью на круглый кристалл размером 4″-8″, также может применяться для односторонней полировки и обработки с высокой точностью на другие жесткие хрупкие материалы с одинаковыми размерами.
Ⅱ. Главные технические параметры
1. Размер главного полировального круга: φ1282mm.
2. Диаметр несущего круга: φ485mm.
3. Скорость оборотов главного полировального круга: 0-63rpm.
4. Количество полировальной головки: 4 шт
5. Скорость оборотов полировальной головки: 0-63rpm.
6. Диаметр/ход цилиндра для подъема и спуска полировальной головки: 200mm/250.5mm.
7. Приводной электродвигатель главного полировального круга: 22kW.
8. Приводной электродвигатель полировальной головки: 4×0.75kW.
9. Электропитание: 380V/220V±10 % 50/60Hz±10 %
10. Источник газа: 0.5-0.6MPa.
11. Расходы на воздух: 60L/min.
12. Масса оборудования: около 7500 кг.
13. Габаритный размер: 3046mm×1806mm×2516mm
Ⅲ. Способность обработки
Для одной головки: 11 шт/φ4″ 8 шт/φ5″ 6 шт/φ6″ 3 шт/φ8″
Для четырёх головок: 44 шт/φ4″ 32 шт/φ5″ 24 шт/φ6″ 12 шт/φ8″

В нижеследующем описание станка на английском языке:
X62 485-2 Polishing Machine
Application
This machine is mainly used for accurately single-sided polishing of silicon wafers with diameter from 4" to 8", and also could used to polishing other hard and fragile flat materials.
Main Specifications:
1. The main polishing plates adopts high accurate bearing to support. The special worm wheel reducer is transmitted through belt, the tranmission is stable with high accuracy.
2.The main motor drive by high-performance inverter.
3. The main polishing plates adopts centralized cooling set. The flow rate of cooling water could be change through automatically detecting of the tempreture of the plates’surface, so that the tempreture could be controlled accurately. This insures a accurately constant control of the tempreture during polishing.
4. The upper polishing head drive by four high-performance reducer. It is controled by four high-performance inverter, and without any vibration or impact.
5. The pressure of the four polishing head adoptes pressure-feedback control mode, and the pressure control is accurate and stable. The setting is convenient, and the pressure could be set into many steps. It could be used in a more wide range.
6. The polishing head uses variable cross section structure, this eliminates the phenomenon of un-even distribution of the pressure.
7. The supplying system of slurry solution could heating the polishing solution and detect the tempreture, and also has other functions. The polishing solution bucket is made of non-metal material, and avoid the pollution of polishing solution effectively.
8. Electric control adopts PLC and HMI PT control mode. This system is advanced and reliable; pressure, speed and tempreture all could be controled through automatic setting, and speed could be controled and detected immediately.
9.The control of the pressure and speed could be set into many steps or groups of technics parameter according to users’requirments. When in automatic condition, the speed of the bottom plate and upper plate system could be set separately, while in manual operation condition, it could be set through panel potentiometer.

Main Specifications:
1 Main polishing plate diameter: φ1282mm
2 Polishing head diameter: φ485mm
3 Rotation speed of main polishing plate: 0～63rpm
4 Polishing head No. 4
5 Rotation speed of polishing head: 0～63rpm
6 Polishing head cylinder 200mm/250.5mm
7 Main polishing plate drive motor 22kW
8 Polishing head drive motor 4×0.75kW
9 Power 380V/220V±10 % 50/60Hz±10 %
10 Air supply 0.5-0.6Mpa
3.11 Air consumption 60L/min
12 Machine weight about 7500kg
13 Machine dimension(L×W×H) 3046mm×1806mm×2516mm